Dreaming of funding your next tech breakthrough? The Chinese mainland just made it easier.
On Wednesday, the People’s Bank of China (PBOC) and the China Securities Regulatory Commission jointly unveiled a package of measures designed to energize the issuance of sci-tech innovation bonds. The move aims to link cutting-edge tech firms with fast, flexible capital.
Commercial banks, securities firms, and financial asset investment companies are now eligible to issue these bonds, widening the playing field beyond traditional issuers. Additional steps include streamlined information disclosures, optimized credit ratings, and more agile issuance management.
This push complements the launch in March of a dedicated sci-tech board in the bond market, part of the Chinese mainland’s broader strategy to build a global technology powerhouse.
Early signals are strong: nearly 100 market entities are preparing to float more than 300 billion yuan (about $41.7 billion) in sci-tech innovation bonds, with further participation expected.
Experts say that by lowering entry barriers and smoothing funding pathways, these measures could supercharge research and development, accelerate startup growth, and boost the Chinese mainland’s role in global innovation.
Reference(s):
cgtn.com
